The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2004
Filed:
Dec. 21, 2001
Applicant:
Inventors:
Song-Hua Shi, Phoenix, AZ (US);
Milan Djukic, Gilbert, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
The present invention relates to a method of packaging a microelectronic device that, in one embodiment, uses a vacuum-assisted underfill process. One embodiment of the method uses a curing process with a tacky film disposed over the device to prevent wicking of the underfill material after the underfill material is in place. One embodiment of the method uses a curing process that utilizes a non-tacky tacky film with a curing process to prevent wicking of the underfill material after the underfill material is in place.