This inventor holds 1 USPTO granted patent. Top assignee: Ttm Technologies Inc.. Active years: 2023.
Company Filing History:
Years Active: 2023
Title: Innovations by Mike Lugert in Printed Circuit Board Technology
Introduction
Mike Lugert is an accomplished inventor based in East Syracuse, NY (US). He has made significant contributions to the field of printed circuit board (PCB) technology. His innovative approach has led to the development of a unique method for manufacturing PCBs with engineered thermal paths.
Latest Patents
Mike Lugert holds a patent for a "Method of manufacturing printed circuit board assemblies with engineered thermal paths." This patent describes a PCB that includes complementary cavities formed on opposite sides. These cavities are in thermal and/or electrical communication, creating an engineered thermal path. Each cavity is filled with a thermally conductive material, providing a thermal pathway for circuits and components. The manufacturing method includes drilling and milling each cavity, panel plating, and filling the cavities with suitable materials. He has 1 patent to his name.
Career Highlights
Mike has been instrumental in advancing PCB technology through his innovative methods. His work has been recognized within the industry, showcasing his expertise and commitment to improving electronic manufacturing processes. He is currently employed at TTM Technologies Inc., where he continues to contribute to the field.
Collaborations
Mike has collaborated with talented coworkers, including Rick Bauer and Jerrad Martinson. Their combined efforts have fostered a creative environment that encourages innovation and excellence in PCB manufacturing.
Conclusion
Mike Lugert's contributions to printed circuit board technology exemplify the spirit of innovation. His patented methods enhance the efficiency and effectiveness of PCB manufacturing, making a lasting impact in the industry.