Mike Len

Title: Innovations by Mike Len in Printed Circuit Board Technology

Introduction

Mike Len is an accomplished inventor based in East Syracuse, NY (US). He has made significant contributions to the field of printed circuit board (PCB) technology. His innovative approach focuses on enhancing the thermal management of PCBs, which is crucial for the performance and reliability of electronic devices.

Latest Patents

Mike Len holds a patent for a "Method of manufacturing printed circuit board assemblies with engineered thermal paths." This patent describes a PCB that includes complementary cavities formed on opposite sides of the board. These cavities are designed to be in thermal and/or electrical communication, creating an engineered thermal path. Each cavity is filled with a thermally conductive material, providing an effective thermal pathway for the circuits and components of the PCB. The manufacturing method includes drilling and/or milling each cavity, panel plating the cavities, and filling them with a suitable material.

Career Highlights

Mike Len is currently employed at TTM Technologies Inc., where he applies his expertise in PCB manufacturing. His work focuses on developing innovative solutions that improve the efficiency and performance of electronic components. With a patent portfolio that includes 1 patent, he continues to push the boundaries of technology in his field.

Collaborations

Throughout his career, Mike has collaborated with talented professionals such as Rick Bauer and Jerrad Martinson. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Mike Len's contributions to the field of printed circuit board technology exemplify the importance of innovation in electronics. His patented methods enhance thermal management, which is vital for the advancement of electronic devices. His work at TTM Technologies Inc. and collaborations with colleagues further highlight his commitment to excellence in engineering.