Ibaraki, Japan

Mika Takashima

This inventor holds 2 USPTO granted patents. Top assignee: Nitto-Denko Corporation. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mika Takashima. Retrieved from https://idiyas.com/inventor/mika-takashima-gy53w81f

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 50.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024-2026

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2 patents (USPTO):Explore Patents

Title: Mika Takashima: Innovator in Adhesive Technology

Introduction

Mika Takashima is a notable inventor based in Ibaraki, Japan. She has made significant contributions to the field of adhesive technology, particularly through her innovative patent.

Latest Patents

Mika holds a patent for an adhesive composition, adhesive sheet, and adhered body. This adhesive composition contains at least a polymer and an ionic liquid. The unique formulation allows for the creation of an ionic liquid-free adhesive layer that exhibits a relative permittivity of 5 or more at a frequency of 100 Hz, after being left to stand in an environment of 22° C. and 20% relative humidity for three days. This innovation has potential applications in various industries requiring effective adhesion solutions.

Career Highlights

Mika is currently employed at Nitto-Denko Corporation, a leading company in the adhesive and material technology sector. Her work focuses on developing advanced adhesive solutions that meet the evolving needs of the market.

Collaborations

Mika collaborates with talented coworkers, including Kaori Mizobata and Kaori Akamatsu. Their combined expertise contributes to the innovative projects at Nitto-Denko Corporation.

Conclusion

Mika Takashima's contributions to adhesive technology exemplify the impact of innovative thinking in the field. Her patent reflects a commitment to advancing material science and enhancing product performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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