Mihir Roy

Title: Innovator Mihir Roy: A Pioneer in Advanced Packaging Technology

Introduction

Mihir Roy, an inventive mind located in Richardson, TX, has made a significant impact in the field of advanced packaging technology. With a total of 4 patents to his name, Roy's contributions to the industry showcase his innovative spirit and dedication to engineering excellence.

Latest Patents

Mihir Roy's latest patents focus on enhancing package architecture and heat management in electronic devices. One notable patent is the "System in package with flip chip die over multi-layer heatsink stanchion." This invention involves a sophisticated design featuring a chiplet with layered-cake shaped heatsink stanchions that effectively dissipate heat generated by both the first and second dies within the package architecture. This innovation ensures optimal performance and longevity of electronic devices.

Another key patent is titled "Package architecture utilizing wafer to wafer bonding." This patent describes a package architecture that includes a package carrier with both a first and a second device die mounted on it, using a heat spreader for efficient thermal management. Notably, the materials used in the first and second device bodies differ, demonstrating Roy's commitment to exploring diverse solutions to enhance device functionality.

Career Highlights

Throughout his career, Mihir Roy has developed cutting-edge technologies while working at Qorvo US, Inc., a company recognized for its advancements in radio frequency (RF) solutions. His role has allowed him to contribute to essential projects that advance the capabilities of modern electronic devices, placing him at the forefront of innovation in the tech industry.

Collaborations

In his endeavors, Roy has collaborated with talented individuals such as Anthony M. Chiu and Robert Charles Dry. Their joint efforts reflect a team-oriented approach to innovation, allowing them to harness their collective expertise to tackle complex challenges in packaging technologies.

Conclusion

Mihir Roy's journey as an inventor exemplifies the fusion of creativity and engineering. His impressive portfolio of patents not only addresses current challenges in electronic device packaging but also paves the way for future advancements. As he continues to work with leading companies like Qorvo US, Inc., Roy's contributions are sure to leave a lasting impact on the industry.