The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2023

Filed:

Mar. 31, 2021
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Anthony Chiu, Richardson, TX (US);

Robert Charles Dry, Plano, TX (US);

Mihir Roy, Richardson, TX (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/4853 (2013.01); H01L 21/4871 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 24/16 (2013.01); H01L 25/072 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/18161 (2013.01);
Abstract

The present disclosure relates to a package architecture and a method for making the same. The disclosed package architecture includes a package carrier, a first device die and a second device die mounted on the package carrier, and a heat spreader. The first device die includes a first device body with a thickness between 5 μm and 130 μm, a die carrier, and an attachment section between the first device body and the die carrier, while the second device die includes a second device body. The first device body and the second device body are formed of different materials. A top surface of the die carrier of the first device die and a top surface of the second device body of the second device die are substantially coplanar. The heat spreader resides over the top surface of the die carrier and the top surface of the second device body.


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