Nagoya, Japan

Michiyo Mizutani


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 82(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):

Title: Michiyo Mizutani: Innovator in Semiconductor Bonding Technology

Introduction

Michiyo Mizutani is a prominent inventor based in Nagoya, Japan. She has made significant contributions to the field of semiconductor technology, particularly in bonding materials and methods. Her innovative work has led to the development of a patented bonding technique that enhances the performance and reliability of semiconductor devices.

Latest Patents

Mizutani holds a patent for a bonding material and bonding method for electric elements. This invention focuses on a material and method for bonding a semiconductor device to a pedestal, ensuring sufficient bonding strength and stable electric contact. The patent describes a process where a Ni layer and an Au-Sn solder layer are formed on an n-type electrode of a semiconductor laser device. The solder layer is melted and bonded to a heat sink with Au-plating. The film thickness of the Ni layer is set to approximately 500 angstroms or more. The mutual diffusion of Ni and Sn during the melting process improves bonding strength and wettability. Additionally, by adjusting the composition ratio of the Ni layer to the Au-Sn solder layer, bonding can be achieved at a lower melting point while maintaining higher bonding strength.

Career Highlights

Mizutani's career is marked by her dedication to advancing semiconductor technology. She has worked at Nippondenso Co., Ltd., where she has collaborated with other talented professionals in the field. Her innovative approach to bonding materials has positioned her as a key figure in the industry.

Collaborations

Mizutani has worked alongside notable colleagues such as Yuji Kimura and Kinya Atsumi. Their collaborative efforts have contributed to the success of various projects and advancements in semiconductor technology.

Conclusion

Michiyo Mizutani's contributions to semiconductor bonding technology exemplify her innovative spirit and dedication to her field. Her patented methods have the potential to significantly enhance the performance of semiconductor devices, making her a noteworthy inventor in the industry.

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