Company Filing History:
Years Active: 2020-2024
Title: Michiel Van Soestbergen: Innovator in Circuit Reliability
Introduction
Michiel Van Soestbergen is a notable inventor based in Wageningen, Netherlands. He has made significant contributions to the field of circuit reliability, holding a total of 3 patents. His work focuses on improving the performance and durability of semiconductor devices.
Latest Patents
One of his latest patents is titled "Degradation monitor for bond wire to bond pad interfaces." This device includes a substrate with a bond pad and a stacked bond ball structure. The structure is designed to measure the resistance of the interface between the first bond ball and the bond pad, allowing for the assessment of degradation over time. Another significant patent is the "Method and apparatus for improved circuit structure thermal reliability on printed circuit board materials." This invention aims to reduce stress in semiconductor device packages during cooling after solder reflow operations. By optimizing the orientation of PCB traces, the device minimizes thermal-induced stress, enhancing the reliability of the circuit structure.
Career Highlights
Michiel is currently employed at NXP B.V., a leading company in the semiconductor industry. His innovative work has positioned him as a key player in enhancing circuit reliability and performance.
Collaborations
Throughout his career, Michiel has collaborated with talented individuals such as Leo Van Gemert and Jeroen Johannes Maria Zaal. These partnerships have contributed to the advancement of his projects and innovations.
Conclusion
Michiel Van Soestbergen is a distinguished inventor whose work in circuit reliability has led to valuable patents and advancements in semiconductor technology. His contributions continue to impact the industry positively.