The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Jun. 06, 2022
Applicant:

Nxp B.v., Eindhoven, NL;

Inventors:

Michiel van Soestbergen, Wageningen, NL;

Amar Ashok Mavinkurve, Malden, NL;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2889 (2013.01);
Abstract

A device comprises a substrate and a stacked bond ball structure. The substrate comprises a bond pad, and the stacked bond ball structure comprises a first and a second bond ball. The first bond ball is in contact with the bond pad, and the second bond ball is positioned on the first bond ball. The stacked bond ball structure is configured to be coupled to a resistance-sensing circuit, such that a resistance of an interface between the first bond ball and the bond pad can be measured to determine an amount of degradation of the interface between the first bond ball and the bond pad. In some implementations, the device further comprises a controller configured to obtain a measured resistance of the interface from the resistance-sensing circuit and determine the amount of degradation of the interface based at least in part on the measured resistance.


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