Shiga, Japan

Michi Ogata

This inventor holds 1 USPTO granted patent and 5 published patent applications. Top assignee: Sumitomo Electric Printed Circuits, Inc.. Active years: 2026.

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Michi Ogata: Innovator in Printed Wiring Board Technology

Introduction

Michi Ogata is a prominent inventor based in Shiga, Japan. She has made significant contributions to the field of printed wiring board technology. With a focus on innovation, Ogata has developed a patented design that enhances the efficiency and functionality of printed wiring boards.

Latest Patents

Michi Ogata holds a patent for a printed wiring board. The invention comprises a substrate, a first wiring layer with a first wiring disposed directly or indirectly on the substrate, and a second wiring layer with a second wiring also disposed directly or indirectly on the substrate. Notably, the average wire width of the first wiring is 40 μm or less, while the average wire width of the second wiring is 50 μm or more. This innovative design aims to improve the performance and reliability of electronic devices.

Career Highlights

Ogata is currently employed at Sumitomo Electric Printed Circuits, Inc. Her work at this esteemed company has allowed her to apply her expertise in printed wiring board technology. She has been instrumental in advancing the company's product offerings and enhancing their technological capabilities.

Conclusion

Michi Ogata is a trailblazer in the field of printed wiring board technology, with a patented invention that showcases her innovative spirit. Her contributions continue to impact the electronics industry positively.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…