The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Jul. 28, 2022
Applicant:
Sumitomo Electric Printed Circuits, Inc., Shiga, JP;
Inventors:
Michi Ogata, Shiga, JP;
Kou Noguchi, Shiga, JP;
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Shiga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); H05K 1/0218 (2013.01); H05K 3/108 (2013.01); H01F 27/2804 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/0939 (2013.01); H05K 2201/09727 (2013.01);
Abstract
The printed wiring board according to an embodiment of the present disclosure comprises: a substrate; a first wiring layer having a first wiring that is disposed directly or indirectly on the substrate; and a second wiring layer having a second wiring that is disposed directly or indirectly on the substrate. The average wire width of the first wiring is 40 μm or less, and the average wire width of the second wiring is 50 μm or more.