Milan, Italy

Michele Monopoli

This inventor holds 4 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2001-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michele Monopoli. Retrieved from https://idiyas.com/inventor/michele-monopoli

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2001-2006

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4 patents (USPTO):Explore Patents

Title: Michele Monopoli: Innovator in Hybrid Multi Chip Modules

Introduction

Michele Monopoli is a notable inventor based in Milan, Italy. He has made significant contributions to the field of electronics, particularly in the development of Hybrid Multi Chip Modules (HMCM). With a total of 4 patents to his name, Monopoli's work has had a substantial impact on the industry.

Latest Patents

One of his latest patents focuses on a ball grid array module. The method described in this patent addresses the issue of gold contamination during Surface Mount Technology (SMT) assembly operations in the manufacture of HMCM. By protecting the gold with a thin layer of a water-soluble paste, Monopoli's invention achieves a high assembly process yield. This protective layer, measuring between 0.02 to 0.03 millimeters, is not only strong but also easy to remove, as it dissolves in water.

Career Highlights

Michele Monopoli is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to further develop his innovative ideas and contribute to cutting-edge technology in the electronics sector.

Collaborations

Throughout his career, Monopoli has collaborated with talented individuals such as Vittorio Sirtori and Lorenza Lombardi. These collaborations have enriched his work and fostered a creative environment for innovation.

Conclusion

Michele Monopoli is a distinguished inventor whose contributions to the field of electronics, particularly in Hybrid Multi Chip Modules, have been invaluable. His innovative methods and collaborations continue to shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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