The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2006
Filed:
May. 12, 2003
Luigi Giussani, Milan, IT;
Lorenza Lombardi, Milan, IT;
Michele Monopoli, Milan, IT;
Vittorio Sirtori, Milan, IT;
Franco Zambon, Milan, IT;
Luigi Giussani, Milan, IT;
Lorenza Lombardi, Milan, IT;
Michele Monopoli, Milan, IT;
Vittorio Sirtori, Milan, IT;
Franco Zambon, Milan, IT;
International Business Machines Corporation, Armonk, NY (US);
Abstract
The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02–0.03 millimeter) of a paste very soluble in water and washing it off. The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.