Company Filing History:
Years Active: 2003-2006
Title: Luigi Giussani: Innovator in Hybrid Multi Chip Modules
Introduction
Luigi Giussani is a notable inventor based in Milan, Italy. He has made significant contributions to the field of electronics, particularly in the development of Hybrid Multi Chip Modules (HMCM). With a total of 2 patents, Giussani's work has had a considerable impact on the industry.
Latest Patents
One of Giussani's latest patents focuses on a Ball Grid Array Module. The method described in this patent addresses the issue of gold contamination during Surface Mount Technology (SMT) assembly operations in the manufacture of HMCM. By protecting the gold with a thin layer of a water-soluble paste, the assembly process yield is significantly improved. This protective layer, measuring between 0.02 to 0.03 millimeters, is not only strong but also easy to remove, as it dissolves in water.
Career Highlights
Giussani is currently associated with International Business Machines Corporation (IBM), where he continues to innovate and contribute to advancements in technology. His expertise in the field has positioned him as a key player in the development of efficient manufacturing processes for electronic components.
Collaborations
Some of his notable coworkers include Lorenza Lombardi and Michele Monopoli. Their collaborative efforts have further enhanced the innovative environment in which Giussani works.
Conclusion
Luigi Giussani's contributions to the field of electronics, particularly through his patents related to Hybrid Multi Chip Modules, demonstrate his commitment to innovation. His work continues to influence the industry, paving the way for future advancements in technology.