St. Paul, MO, United States of America

Michele Haler


Average Co-Inventor Count = 5.1

ph-index = 2

Forward Citations = 63(Granted Patents)


Company Filing History:


Years Active: 2004-2006

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2 patents (USPTO):Explore Patents

Title: Michele Haler: Innovator in Semiconductor Processing

Introduction

Michele Haler is a notable inventor based in St. Paul, MO (US), recognized for her contributions to semiconductor processing technology. With a total of two patents to her name, she has made significant advancements in the field, particularly in the design and functionality of wafer carriers and polishing methods.

Latest Patents

Michele's latest patents include a wafer carrier designed to retain semiconductor wafers during processing operations. This innovative carrier allows for the simultaneous removal of material from both the front and back sides of each wafer. The design features a plate with a specific thickness and an insert that holds the wafer securely while minimizing contamination. Her second patent outlines a novel method and apparatus for processing semiconductor wafers, which includes a final polishing operation that enhances the parallelism of the wafer surfaces. This method ensures that the front surface is adequately prepared for integrated circuit fabrication, incorporating advanced techniques for hydrodynamic lubrication and polishing pad conditioning.

Career Highlights

Michele Haler is currently employed at MEMC Electronic Materials, Inc., where she continues to develop innovative solutions for the semiconductor industry. Her work has been instrumental in improving the efficiency and effectiveness of wafer processing techniques.

Collaborations

Michele collaborates with talented individuals such as Alexis Grabbe and Mick Bjelopavlic, contributing to a dynamic team focused on advancing semiconductor technologies.

Conclusion

Michele Haler's contributions to semiconductor processing through her patents and work at MEMC Electronic Materials, Inc. highlight her role as a key innovator in the field. Her advancements in wafer carrier design and polishing methods are paving the way for future developments in integrated circuit fabrication.

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