The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
May. 20, 2003
Mick Bjelopavlic, O'Fallon, MO (US);
Alexis Grabbe, Harvester, MO (US);
Michele Haler, St. Paul, MO (US);
Tracy M. Ragan, Warrenton, MO (US);
Mick Bjelopavlic, O'Fallon, MO (US);
Alexis Grabbe, Harvester, MO (US);
Michele Haler, St. Paul, MO (US);
Tracy M. Ragan, Warrenton, MO (US);
MEMC Electronic Materials, Inc., St. Peters, MO (US);
Abstract
A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction. The processing apparatus is adapted for removing wafer material from a front side and a back side of each wafer simultaneously. The carrier includes a plate including wafer contaminating material and having an opening and a thickness. An insert has a thickness and is disposed in the opening for receiving at least one wafer and engaging a peripheral edge of the wafer to hold the wafer as the carrier rotates. The thickness of the insert is significantly greater than the thickness of the plate to inhibit removal of material from the plate and thereby inhibit bulk metal contamination of the wafer.