This inventor holds 1 USPTO granted patent. Top assignee: Rockwell International Corporation. Active years: 1978.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1978
Title: Micheal E. McCoy and His Metallurgical Invention.
Introduction
Micheal E. McCoy is an inventor associated with Orange, California, and Rockwell International Corporation. His patent work includes a method for attaching silicon-on-sapphire devices to package surfaces.
Latest Patents
McCoy’s listed patent, “Metallurgical Method for Die Attaching Silicon on Sapphire Devices To,” describes a process for bonding a silicon-on-sapphire device to a gold-plated package surface. The method deposits a metal layer, such as tungsten, on the back of the device wafer, followed by a layer of gold. A gold-compatible alloy preform, such as gold-germanium, is placed between the die and package, then heated and cooled to form the bond. McCoy is credited with 1 patent.
Career Highlights
McCoy’s recorded invention addresses the materials and bonding process used to attach silicon-on-sapphire devices to packages. His work is associated with Rockwell International Corporation.
Collaborations
McCoy’s listed coworkers include Herbert A. Bell and Francis J. Woolston.
Conclusion
Micheal E. McCoy’s patent documents a metallurgical approach to die attachment that combines layered materials and an alloy preform to bond silicon-on-sapphire devices to gold-plated packages.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile