The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 1978

Filed:

Apr. 14, 1977
Applicant:
Inventors:

Herbert A Bell, La Habra, CA (US);

Micheal E McCoy, Orange, CA (US);

Francis J Woolston, Santa Ana, CA (US);

Assignee:

Rockwell International Corporation, El Segundo, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; B01J / ;
U.S. Cl.
CPC ...
228123 ; 228263 ;
Abstract

A method for attaching a silicon-on-sapphire (SOS) device to a gold-plated surface of a package for the device. A layer of a metal adherent to both sapphire and gold such as, for example, tungsten, is deposited on the back side of a wafer of the devices. A layer of gold is then deposited on the tungsten layer. A preform of an alloy compatible with gold, such as gold-germanium, interposed between and in contact with the die and the package, is heated and then cooled to bond the die to the surface of the package.


Find Patent Forward Citations

Bell, Herbert. (1978). Metallurgical method for die attaching silicon on sapphire devices to (U.S. Patent No. 4078711). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4078711

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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