Zichron-Yaakov, Israel

Michal Shlomai Hermon

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Mellanox Technologies, Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michal Shlomai Hermon. Retrieved from https://idiyas.com/inventor/michal-shlomai-hermon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Michal Shlomai Hermon: Inventor of a Liquid-Cooled Network-Interface Controller Assembly.

Introduction

Michal Shlomai Hermon is an inventor based in Zichron-Yaakov, Israel. His work includes a patent for a liquid-cooled network-interface controller assembly, developed in connection with Mellanox Technologies, Ltd.

Latest Patents

Hermon’s listed patent is “Liquid Cooled Network-Interface Controller (NIC) Assembly.” It describes an assembly designed to receive and operably engage a transceiver module. The design includes a printed circuit board and two thermally conductive members arranged to transfer heat to a liquid cooling unit. The members are thermally isolated from one another, while the cooling unit can engage both and dissipate their heat. The patent also covers related manufacturing methods.

Hermon is credited with 1 patent.

Career Highlights

Hermon’s patent work addresses thermal management in network-interface hardware. The liquid-cooling approach is intended to help remove heat from components in a NIC assembly.

Collaborations

Hermon is associated with Mellanox Technologies, Ltd. His listed coworkers include Oren Weltsch and Yuval Dagan.

Conclusion

Michal Shlomai Hermon’s patented NIC assembly focuses on liquid cooling as a way to manage heat in network-interface hardware.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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