The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Apr. 02, 2024
Applicant:

Mellanox Technologies, Ltd., Yokneam, IL;

Inventors:

Oren Weltsch, The Golan Heights, IL;

Yuval Dagan, Gilon, IL;

Michal Shlomai Hermon, Zikhron Ya'akov, IL;

Rom Becker, Ramat Yishai, IL;

Rachel Ruvel, Kiryat Ata, IL;

Kfir Katz, Tivon, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 7/20254 (2013.01); H05K 7/20772 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01);
Abstract

Assemblies and methods of manufacturing are provided for a liquid cooled network-interface controller (NIC) assembly configured to receive and operably engage a transceiver module. An example liquid cooled NIC assembly includes a PCB, a first thermally conductive member supported by the PCB, and a second thermally conductive member supported by the first thermally conductive member. The first thermally conductive member is thermally isolated from the second thermally conductive member. A liquid cooling unit may thermally engage the first thermally conductive member and the second thermally conductive member. The first thermally conductive member and the second thermally conductive member are configured to conduct heat toward the liquid cooling unit, such that the liquid cooling unit may dissipate heat from the first thermally conductive member and the second thermally conductive member.


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Weltsch, Oren. (2026). Liquid cooled network-interface controller (nic) assembly (U.S. Patent No. 12787148). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787148

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