Michael Scarpulla

Title: Innovations of Michael Scarpulla: Pioneering Compact Inductor Technology

Introduction

Michael Scarpulla is an inventive force based in Salt Lake City, UT. With a dynamic career in engineering and innovation, he has secured two notable patents that contribute significantly to the fields of integrated circuits and material science.

Latest Patents

His latest patents reflect cutting-edge advancements in technology. The first patent focuses on an ultra-compact inductor made of 3D Dirac semimetal. This invention revolutionizes inductor technology usage in integrated circuits, particularly RF ICs, by utilizing 3-dimensional Dirac materials. Unlike conventional inductors that require significant space due to their winding around insulative cores, Scarpulla's ultra-compact devices minimize the footprint on integrated circuits. These devices employ a geometric shape formed from a Dirac material, ensuring a more efficient use of space while maintaining functionality. Additionally, the patent outlines low-temperature manufacturing methods that are compatible with CMOS technology.

The second patent involves a method of creating cadmium telluride (CdTe) films, showcasing innovative techniques in material assembly. This method features heterogeneous nucleation of CdTe directly on substrates through sequential deposition of precursor solutions containing cadmium and telluride ions. The process involves two critical steps: applying the cadmium precursor solution to form a film, followed by the telluride precursor solution that adherently develops a CdTe film directly on the substrate.

Career Highlights

Michael Scarpulla’s career is marked by significant contributions to material sciences and engineering within the University of Utah Research Foundation. His work not only exemplifies innovation but also enhances the realms of practical applications in electronics and materials engineering.

Collaborations

In his pursuit of innovation, Scarpulla collaborates with esteemed colleagues such as Carina Hahn and Dennis Pruzan. Their combined expertise facilitates groundbreaking research and development, further reinforcing the impact of his inventions.

Conclusion

In summary, Michael Scarpulla is an exemplary inventor whose contributions to the field of integrated circuits and materials science are noteworthy. His patents not only address prevalent challenges in the industry but also set a foundation for future innovations. Through his ongoing work at the University of Utah Research Foundation, Scarpulla continues to push the boundaries of technology, paving the way for future advancements.