Michael S Lacy

Title: Michael S. Lacy: Innovator in Polishing Pad Technology

Introduction

Michael S. Lacy is a notable inventor based in Naperville, IL (US). He has made significant contributions to the field of chemical-mechanical polishing through his innovative designs and patents. With a total of 2 patents, Lacy continues to push the boundaries of technology in his industry.

Latest Patents

Lacy's latest patents focus on multi-layer polishing pad materials for chemical-mechanical polishing (CMP). The first patent describes a multi-layer polishing pad that comprises a porous polishing layer and a porous bottom layer. The bottom layer is substantially coextensive with the polishing layer, and they are joined without the use of an adhesive. The polishing layer has an average surface roughness, Ra, that is greater than that of the bottom layer. The second patent also addresses a multi-layer polishing pad, which includes a polishing layer and a bottom layer that are joined together without adhesive. This invention further includes a polishing pad made from an optically transmissive multi-layer polishing pad material, with layers joined without adhesive.

Career Highlights

Michael S. Lacy is currently employed at Cabot Microelectronics Corporation, where he applies his expertise in polishing pad technology. His work has been instrumental in advancing the efficiency and effectiveness of chemical-mechanical polishing processes.

Collaborations

Lacy collaborates with talented individuals such as Abaneshwar Prasad and Roland K. Sevilla. Their combined efforts contribute to the innovative environment at Cabot Microelectronics Corporation.

Conclusion

Michael S. Lacy is a prominent figure in the field of polishing pad technology, with a focus on innovative solutions for chemical-mechanical polishing. His contributions through patents and collaborations continue to shape the industry.