Company Filing History:
Years Active: 2004-2009
Title: Michael Rattner: Innovator in Plasma Etching Technology
Introduction
Michael Rattner is a prominent inventor based in Santa Clara, CA, known for his significant contributions to the field of plasma etching technology. With a total of seven patents to his name, Rattner has developed innovative methods that enhance the manufacturing processes of silicon-containing substrates.
Latest Patents
Among his latest patents are two notable inventions focused on plasma etching. The first patent describes a silicon-containing structure with deep etched features and a method of manufacture. This method allows for the plasma etching of deeply recessed features, such as trenches of at least 5 micrometers in depth, while ensuring smooth sidewalls with a roughness of less than 1 micrometer. The sidewall taper angle typically ranges from 85° to 92°, showcasing the precision of the technique. The second patent outlines a method of plasma etching a deeply recessed feature in a substrate using a plasma source gas modulated etchant system. This method also emphasizes the generation of smooth sidewalls and incorporates a stabilizing etchant species used consistently during the etching process.
Career Highlights
Michael Rattner is currently employed at Applied Materials, Inc., a leading company in the semiconductor manufacturing industry. His work has significantly impacted the efficiency and quality of semiconductor fabrication processes.
Collaborations
Rattner has collaborated with notable colleagues, including Jeffrey D. Chinn and Rolf A. Guenther, contributing to advancements in their shared field of expertise.
Conclusion
Michael Rattner's innovative work in plasma etching technology has established him as a key figure in the semiconductor industry. His patents reflect a commitment to improving manufacturing processes and enhancing the quality of silicon-based products.