This inventor holds 1 USPTO granted patent. Top assignee: Union Semiconductor Technology Corporation. Active years: 2005.
Company Filing History:
Years Active: 2005
Title: Michael Paul Fleischer: Innovator in Semiconductor Technology
Introduction
Michael Paul Fleischer is a notable inventor based in Eau Claire, WI (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to metal layer processing.
Latest Patents
Fleischer holds a patent for a process to pattern thick TiW metal layers using uniform and selective etching. This method involves processing a thick TiW metal layer on a dielectric layer, which has been deposited on a substrate, such as silicon. The process includes depositing the TiW metal layer onto the dielectric layer, followed by the application of a photoresist. The method effectively removes a substantial portion of the TiW metal layer not in contact with the photoresist using a uniform etch. Subsequently, the TiW metal layer is selectively etched to the dielectric layer, allowing for a faster removal rate of the TiW metal layer compared to the dielectric layer.
Career Highlights
Fleischer is currently employed at Union Semiconductor Technology Corporation, where he continues to advance his work in semiconductor innovations. His expertise in the field has led to the development of efficient processes that enhance the manufacturing of semiconductor devices.
Collaborations
Throughout his career, Fleischer has collaborated with notable colleagues, including Hans Peter Mikelson and Gloria Marie Lee. These partnerships have contributed to the advancement of technology in their respective fields.
Conclusion
Michael Paul Fleischer's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the industry. His work continues to influence the development of efficient manufacturing processes in the semiconductor sector.