Conklin, NY, United States of America

Michael Murray Yingling


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Michael Murray Yingling: Innovator in Modular Die Handling Systems

Introduction

Michael Murray Yingling is an accomplished inventor based in Conklin, NY (US). He holds a patent for a modular die handling system that enhances the efficiency of processing dies from various types of pre-expanded wafer materials. His innovative approach has made significant contributions to the field of die handling systems.

Latest Patents

Yingling's notable patent is titled "Modular Die Handling System." This invention focuses on die handling systems and methods for preparing or processing dies from multiple types of pre-expanded wafer materials. The system is designed in a modular fashion, allowing for concurrent processes that expand the wafers, process them, extract the dies, and inspect the extracted dies without any of the processes remaining idle. The wafer handler module includes a mechanism, such as an expander, capable of stretching or expanding wafers of various sizes to a pre-expanded state without interrupting the die handler. The pre-expanded wafers are stored in a proprietary cartridge and delivered to the die handler, where a pick head removes each die from the pre-expanded wafer and delivers the extracted dies to subsequent machinery for further processing.

Career Highlights

Yingling is currently employed at Universal Instruments Corporation, where he continues to innovate and develop advanced technologies in the field of die handling systems. His work has been instrumental in improving the efficiency and effectiveness of die processing.

Collaborations

Some of his coworkers include Sean Michael Adams and David W Lyndaker, who contribute to the collaborative environment at Universal Instruments Corporation.

Conclusion

Michael Murray Yingling's contributions to the field of modular die handling systems exemplify his innovative spirit and dedication to advancing technology. His patent reflects a significant step forward in the efficiency of die processing, showcasing his expertise and commitment to innovation.

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