For the Inventor, By the Inventor

Enter assignee name

Conklin, NY, United States of America

Universal Instruments Corporation

USPTO Granted Patents = 151

EPO Patents = 1

Trademarks = 7

Forward Citations = 1,559

Loading Chart...

Loading Chart...

115 inventors (with patents filed for the assignee):

Koenraad Alexander Gieskes (18 out of 23 patents)

Michael D Snyder (17 out of 18 patents)

John E Danek (17 out of 20 patents)

4. Phillip A Ragard (17 out of 17 patents)

5. Henry J Soth (12 out of 12 patents)

6. Albert W Zemek (12 out of 12 patents)

7. Stanley W Janisiewicz (11 out of 12 patents)

8. Crawford A Matson (9 out of 9 patents)

9. Peter Joseph Dionne (8 out of 9 patents)

10. Weibley J Dean (8 out of 8 patents)

11. Douglas A Biesecker (7 out of 11 patents)

12. Richard F Porterfield (7 out of 7 patents)

13. Charles Andrew Coots (6 out of 8 patents)

14. Robert H Holmes (6 out of 6 patents)

15. Frank J Orzelek (6 out of 6 patents)

Core Competencies:

Printed Circuit Board Assembly

Pick-and-Place Machine

Dispensing Head

Flexible Assembly Machine

Component Placement Machine

Vacuum Generation

Optical Contact Sensor

3D TSV Assembly

Component Rejection Station

Modular Die Handling

Spindle Module

Feeder System

151 patents: Sort by Forward Citations

1. 11903137 - Clinch mechanism for assembling a printed circuit board with electronic components (2024-02-13),

2. 11464147 - Spindle module, pick-and-place machine and method of assembly (2022-10-04),

3. 11464146 - Dispensing head, nozzle and method (2022-10-04),

4. 11457549 - Spindle module, bank, and method (2022-09-27),

5. 11412650 - Lead tip illumination device, system, and method (2022-08-09),

6. 11412646 - Spindle bank, pick-and-place machine and method of assembly (2022-08-09),

7. 11382248 - Dispensing head (2022-07-05),

8. 11375651 - Dispensing head, nozzle and method (2022-06-28),

9. 11363748 - Printed circuit board transport (2022-06-14),

10. 11363725 - Fixture to hold part before and after reflow, and method (2022-06-14),

11. 11358247 - Nozzle changer, system, and related method (2022-06-14),

12. 11164765 - Modular die handling system (2021-11-02),

13. 11156993 - Semiconductor die offset compensation variation (2021-10-26),

14. 11044841 - Feeder system, pick and place machine, and method (2021-06-22),

15. 11044814 - Method of assembly (2021-06-22),

Universal Instruments Corporation is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. With a history of innovation spanning over 50 years, Universal provides cutting-edge solutions for a wide range of applications, including surface mount technology (SMT), through-hole technology (THT), semiconductor packaging, and more. Through its comprehensive product portfolio and commitment to customer satisfaction, Universal Instruments is dedicated to helping manufacturers improve productivity, increase efficiency, and achieve higher quality standards.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

151 Patents

#1 in Conklin, NY

#153 in New York

#2,522 in US

#5,273 in the World

Conklin, NY, United States of America

Universal Instruments Corporation

Forward Citations = 1,559

115 inventors:

Koenraad Alexander Gieskes (18 out of 23 patents)

Michael D Snyder (17 out of 18 patents)

John E Danek (17 out of 20 patents)

4. Phillip A Ragard (17 out of 17 patents)

5. Henry J Soth (12 out of 12 patents)

Please report any incorrect information to support@idiyas.com

Loading…