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For the Inventor, By the Inventor

Binghamton, NY, United States of America

Universal Instruments Corporation


USPTO Granted Patents = 151

% Expired Patents = 1.3


Trademarks = 7

Forward Citations = 1,569

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115 inventors (with patents filed for the assignee):

goldMedal Koenraad Alexander Gieskes (18 out of 23 patents)

silverMedal Michael D Snyder (17 out of 18 patents)

bronzeMedal John E Danek (17 out of 20 patents)

4.  Phillip A Ragard (17 out of 17 patents)

5.  Henry J Soth (12 out of 12 patents)

6.  Albert W Zemek (12 out of 12 patents)

7.  Stanley W Janisiewicz (11 out of 12 patents)

8.  Crawford A Matson (9 out of 9 patents)

9.  Peter Joseph Dionne (8 out of 9 patents)

10.  Weibley J Dean (8 out of 8 patents)

11.  Douglas A Biesecker (7 out of 11 patents)

12.  Richard F Porterfield (7 out of 7 patents)

13.  Charles Andrew Coots (6 out of 8 patents)

14.  Robert H Holmes (6 out of 6 patents)

15.  Frank J Orzelek (6 out of 6 patents)


Core Competencies:
Pick-and-Place Machine
Dispensing Head
Printed Circuit Board
Component Placement
Flexible Assembly
Vacuum Nozzle
Solder Bumps
Optical Sensor
Feeder System
Modular Die Handling
Electronic Damping
Drive Mechanism

151 patents:

1. 11903137 - Clinch mechanism for assembling a printed circuit board with electronic components (2024-02-13),
2. 11464147 - Spindle module, pick-and-place machine and method of assembly (2022-10-04),
3. 11464146 - Dispensing head, nozzle and method (2022-10-04),
4. 11457549 - Spindle module, bank, and method (2022-09-27),
5. 11412650 - Lead tip illumination device, system, and method (2022-08-09),
6. 11412646 - Spindle bank, pick-and-place machine and method of assembly (2022-08-09),
7. 11382248 - Dispensing head (2022-07-05),
8. 11375651 - Dispensing head, nozzle and method (2022-06-28),
9. 11363748 - Printed circuit board transport (2022-06-14),
10. 11363725 - Fixture to hold part before and after reflow, and method (2022-06-14),
11. 11358247 - Nozzle changer, system, and related method (2022-06-14),
12. 11164765 - Modular die handling system (2021-11-02),
13. 11156993 - Semiconductor die offset compensation variation (2021-10-26),
14. 11044841 - Feeder system, pick and place machine, and method (2021-06-22),
15. 11044814 - Method of assembly (2021-06-22),
Universal Instruments Corporation, headquartered in Binghamton, NY, specializes in advanced component assembly technologies. The company is renowned for its innovative solutions in pick-and-place machinery, dispensing heads, and printed circuit board assembly. Its expertise extends to flexible assembly systems, vacuum nozzles, solder bumps, and optical sensors, catering to a diverse range of industries. Universal Instruments is committed to enhancing manufacturing efficiency and precision through its cutting-edge technologies.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

Universal Instruments Corporation
151 Patents

#1 in Binghamton, NY

#167 in New York

#2,602 in US

#5,395 in the World

Binghamton, NY (US)
Binghamton, NY, United States of America

Universal Instruments Corporation

Forward Citations = 1,569

115 inventors:

goldMedal Koenraad Alexander Gieskes (18 out of 23 patents)

silverMedal Michael D Snyder (17 out of 18 patents)

bronzeMedal John E Danek (17 out of 20 patents)

4.  Phillip A Ragard (17 out of 17 patents)

5.  Henry J Soth (12 out of 12 patents)

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