The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Jul. 13, 2017
Universal Instruments Corporation, Conklin, NY (US);
Michael Murray Yingling, Conklin, NY (US);
Sean Michael Adams, Rochester, NY (US);
David W. Lyndaker, Holley, NY (US);
Scott C. Proctor, Brockport, NY (US);
UNIVERSAL INSTRUMENTS CORPORATION, Conklin, NY (US);
Abstract
Die handling systems and methods of use for preparing or processing dies from multiple types of pre-expanded wafer materials. The die handling systems are configured in a modular fashion, allowing for concurrent processes to expand the wafers, process the wafers, extract the dies, and inspect the extracted dies without forcing one of the processes of the system to remain idle. Embodiments of the wafer handler module include a mechanism, such as an expander capable of stretching or expanding wafers having one or more different sizes to a pre-expanded state without interrupting the die handler. The pre-expanded wafers are stored as a proprietary cartridge and delivered to the die handler, where a pick head of the die handler removes each die of the pre-expanded wafer and delivers the extracted dies to subsequent machinery, such as a pick and place machine, for further processing.