Michael Meyer

Title: Michael Meyer: Innovator in RF Sputtering Technology

Introduction

Michael Meyer is an accomplished inventor based in Windsor, Colorado. He holds a patent that showcases his expertise in the field of plasma processing technology. His innovative approach has contributed significantly to advancements in the industry.

Latest Patents

Meyer’s notable patent is titled "RF sputtering of multiple electrodes with optimized plasma coupling through the implementation of capacitive and inductive components." This invention involves an apparatus designed to create a substantially atmospheric vacuum environment for plasma processing. It features a radio frequency (RF) power supply located outside the vacuum chamber, an RF matching network operatively coupled to the RF power supply, and multiple electrodes within the vacuum chamber. The electrodes are configured to receive RF power signals from the RF power supply through the RF matching network. During sputtering operations, these RF power signals are delivered simultaneously to the electrodes, enhancing plasma coupling through effective management of inductive and capacitive reactance.

Career Highlights

Throughout his career, Michael Meyer has worked with prominent companies such as Bühler AG and Advanced Energy Industries, Inc. His experience in these organizations has allowed him to refine his skills and contribute to significant technological advancements.

Collaborations

Meyer has collaborated with notable professionals in the field, including Ken Nauman and Masahiro Watanabe. These partnerships have further enriched his work and innovation in plasma processing technology.

Conclusion

Michael Meyer is a distinguished inventor whose contributions to RF sputtering technology have made a lasting impact. His innovative patent and collaborations with industry professionals highlight his commitment to advancing plasma processing techniques.