Advanced Energy Industries, Inc.

Buhler Ag

Michael Meyer

Masahiro Watanabe

Ken Nauman

Michael S Thornton

Sarah Williams

An apparatus comprises a vacuum chamber configured to produce a substantially atmospheric vacuum environment for plasma processing; a radio frequency (RF) power supply located outside of the vacuum chamber; an RF matching network operatively coupled to the RF power supply; and a plurality of electrodes mounted within the vacuum chamber, the plurality of electrodes configured to receive RF power signals from the RF power supply through the RF matching network. The RF power signals are simultaneously delivered to the plurality of electrodes during a sputtering operation. The plurality of electrodes and a set of electrical components are operative to manage the inductive and capacitive reactance for coupling the RF power signals to provide more desirable plasma coupling during the sputtering operation.

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Windsor, CO, United States of America

Michael Meyer