Michael Liccone

Title: Innovator Spotlight: Michael Liccone, A Pioneer in PCB Miniaturization and Integrated Antenna Structures

Introduction:

Michael Liccone, a prolific inventor based in Scotch Plains, NJ, has made significant contributions to the field of electronics with 15 patents to his name. With a focus on PCB miniaturization and integrated antenna structures, Liccone has established himself as a leader in innovation within the tech industry.

Latest Patents:

1. Method and procedure for miniaturizing a multi-layer PCB: Liccone's patent introduces a revolutionary approach to designing multiple layer PCBs by replacing cores with prepreg layers, enhancing structural integrity. This innovation allows for the creation of PCBs with signal layers, ground plane layers, inner signal layers, and a single core substrate layer, separated by prepreg layers.

2. Integrated heatsink and antenna structure: Liccone's patent showcases an integrated heatsink and antenna structure ideal for small and midsized computing devices. The design includes fin components that dissipate thermal energy integrated into a heatsink base, along with radio frequency antenna portions that form a monopole antenna. The heatsink base acts as a ground reference to enhance the omnidirectional pattern of the antenna portions.

Career Highlights:

Currently employed at Veea Inc., Liccone continues to push the boundaries of innovation in electronics. His expertise and dedication have played a crucial role in the development of cutting-edge technologies that have reshaped the industry.

Collaborations:

Liccone has had the privilege of collaborating with talented individuals in his field, including coworkers Shaun Joseph Greaney and Michael Mirabella. Together, they have worked on projects that have garnered recognition for their groundbreaking innovations.

Conclusion:

Michael Liccone's groundbreaking work in PCB miniaturization and integrated antenna structures has cemented his legacy as a pioneer in the tech industry. His patents reflect a commitment to pushing the boundaries of technology and transforming the way we approach electronic design.