The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Sep. 16, 2022
Applicant:
Veea Inc., New York, NY (US);
Inventors:
Shaun Joseph Greaney, Freehold, NJ (US);
Robert Migliorino, Wayne, NJ (US);
Michael Liccone, Scotch Plains, NJ (US);
Clint Smith, Warwick, NY (US);
Assignee:
VEEA INC., New York, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/0218 (2013.01); H05K 1/0231 (2013.01); H05K 1/0242 (2013.01);
Abstract
A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include signal layers, ground plane layers, inner signal layers, and a single core substrate layer. Each of the layers may be separated from the other layers by at least one prepreg substrate layer.