Queen Creek, AZ, United States of America

Michael Kelly

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Amkor Technology Singapore Holding Pte. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Kelly. Retrieved from https://idiyas.com/inventor/michael-kelly-mbnhr4fn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Michael Kelly - Innovator in Semiconductor Packaging

Introduction

Michael Kelly is a notable inventor based in Queen Creek, AZ (US). He has made significant contributions to the field of semiconductor packaging. His innovative work has led to the development of a unique semiconductor package structure and a method for its fabrication.

Latest Patents

Michael Kelly holds 1 patent for his invention titled "Semiconductor package and fabricating method thereof." This patent describes a semiconductor package structure that includes a connect die, which efficiently routes electrical signals between multiple semiconductor dies. The methods outlined in his patent provide various approaches to creating these advanced semiconductor package structures.

Career Highlights

Michael is currently employed at Amkor Technology Singapore Holding Pte. Ltd., where he continues to work on innovative solutions in semiconductor technology. His expertise in this area has positioned him as a valuable asset to his company and the industry at large.

Collaborations

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Conclusion

Michael Kelly's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His work continues to influence the field and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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