This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2007.
Company Filing History:
Years Active: 2007
Title: Michael Keat Lye Lee: Innovator in Packaging Technology
Introduction
Michael Keat Lye Lee is a notable inventor based in Selangor, Malaysia. He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique method that addresses common issues in packaging processes.
Latest Patents
Michael holds a patent for a method titled "Package Warpage Control." This invention involves placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing, the restrainer is removed. An alternative process involves attaching a component die to a substrate with a cavity on its first surface. This process may include dispensing and curing an underfill material in the cavity, followed by attaching a lid to the first surface of the substrate. He has 1 patent to his name.
Career Highlights
Michael is currently employed at Intel Corporation, where he continues to innovate and contribute to advancements in technology. His work at Intel has allowed him to collaborate with other talented professionals in the field.
Collaborations
Some of his notable coworkers include Mun Leong Loke and Soon Chuan Ong. Their collective expertise enhances the innovative environment at Intel Corporation.
Conclusion
Michael Keat Lye Lee exemplifies the spirit of innovation in packaging technology. His contributions are paving the way for more efficient and effective packaging solutions.