Vancouver, Canada

Michael James Smith

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignees: Qualcomm Incorporated, Teradici Corporation. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael James Smith. Retrieved from https://idiyas.com/inventor/michael-james-smith-9ofh5md2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 3 

% Patents Active = 33.3

Average Co-Inventor Count = 4.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2016-2026

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3 patents (USPTO):Explore Patents

Title: Michael James Smith: Innovator in Integrated Circuits and USB Technology

Introduction

Michael James Smith is a notable inventor based in Vancouver, Canada. He has made significant contributions to the fields of integrated circuits and USB technology. With a total of 3 patents, his work reflects a commitment to advancing technological solutions.

Latest Patents

One of his latest patents is titled "Remedial action in an integrated circuit in response to a monitor circuit diagnostic code sequence." This invention focuses on monitoring the timing margin of logic paths within integrated circuits and addressing their degradation. The integrated circuit features a logic path and a monitor circuit that tracks the condition of the logic path, generating diagnostic codes over time. A monitor controller interprets these codes to determine the circuit's condition and initiates remedial actions as necessary.

Another significant patent is "Apparatus and method for optimizing USB-over-IP data transactions." This invention outlines a method for efficiently communicating USB data. The process involves an optimizer that manages SCSI commands between a USB storage driver and a USB hub controller driver, ensuring optimized data transactions and improved performance.

Career Highlights

Michael has worked with prominent companies such as Teradici Corporation and Qualcomm Incorporated. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in technology.

Collaborations

Throughout his career, Michael has collaborated with talented individuals, including Richard Dean Haymond and Haw-Yuan Yang. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Michael James Smith's contributions to integrated circuits and USB technology demonstrate his innovative spirit and dedication to advancing the field. His patents reflect a deep understanding of complex systems and a commitment to improving technological efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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