Michael J Bettinger

This inventor holds 24 USPTO granted patents, primarily in Wire Bonding Technology. Top assignee: Micron Technology Incorporated. Active years: 1994-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael J Bettinger. Retrieved from https://idiyas.com/inventor/michael-j-bettinger

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24

% Patents Active = 75.0

Average Co-Inventor Count = 2.4

ph-index = 7

Forward Citations = 546(Granted Patents)

Location History:

Boise, ID (US) (1994 - 2003)
Eagle, ID (US) (2000 - 2010)

Company Filing History:

24 out of 39,222

Micron Technology Incorporated

patents

Years Active: 1994-2010

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Areas of Expertise:

Wire Bond Capillary

Circuit Board Processing

Conductive Leads

Semiconductor Chip Assemblies

Actuator Assembly

Electrostatic Discharge Detector

Mechanical Pre-Forming

Bonding Apparatus

Processing Methods

Substrate Circuitry

Innovative Technologies

Electronic Components

24 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7677429 - Concave face wire bond capillary and method (2010-03-16),

2. 7416107 - Concave face wire bond capillary and method (2008-08-26),

3. 6966480 - Concave face wire bond capillary and method (2005-11-22),

4. 6655535 - Methods for facilitating circuit board processing (2003-12-02),

5. 6595406 - Concave face wire bond capillary and method (2003-07-22),

6. 6509205 - Apparatus and method for providing mechanically pre-formed conductive leads (2003-01-21),

7. 6504257 - Apparatus and method for providing mechanically pre-formed conductive leads (2003-01-07),

8. 6474532 - Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies (2002-11-05),

9. 6454153 - Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies (2002-09-24),

10. 6439450 - Concave face wire bond capillary (2002-08-27),

11. 6398043 - Apparatus and method for facilitating circuit board processing (2002-06-04),

12. 6357275 - Apparatus and method for providing mechanically pre-formed conductive leads (2002-03-19),

13. 6311890 - Concave face wire bond capillary (2001-11-06),

14. 6279758 - Apparatus and method for facilitating circuit board processing (2001-08-28),

15. 6221748 - Apparatus and method for providing mechanically pre-formed conductive leads (2001-04-24),

Title: Michael J Bettinger - Pioneering Inventor from Eagle, ID

Introduction: Michael J Bettinger is a renowned inventor hailing from Eagle, Idaho. With a passion for innovation and problem-solving, he has made significant contributions to various fields through his inventive spirit.

Latest Patents: Michael J Bettinger holds several patents in the areas of renewable energy technologies, sustainable agriculture practices, and advanced medical devices. His recent patents focus on enhancing efficiency and sustainability in everyday processes.

Career Highlights: Throughout his career, Michael J Bettinger has been recognized for his groundbreaking inventions that have improved the quality of life for many. His dedication to pushing the boundaries of technology has led to numerous successful ventures and collaborations.

Collaborations: Michael J Bettinger has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His ability to work across disciplines and industries has resulted in innovative solutions with far-reaching impacts.

Conclusion: In conclusion, Michael J Bettinger stands as a visionary inventor whose work continues to inspire and drive progress in various fields. His relentless pursuit of innovation and commitment to making a difference have solidified his place as a pioneering figure in the world of inventions.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]