Company Filing History:
Years Active: 2015
Title: Michael Huynh: Innovator in Semiconductor Bonding Technologies
Introduction
Michael Huynh is a notable inventor based in Santa Clara, CA. He has made significant contributions to the field of semiconductor bonding technologies. His innovative approach has led to the development of a unique patent that enhances the efficiency of interconnection elements in semiconductor devices.
Latest Patents
Michael Huynh holds a patent for "TSV fabrication using a removable handling structure." This method involves forming metalized structures in an in-process unit that includes a support material layer with spaced-apart surfaces. The process also incorporates a handling structure and an insulating layer that separates portions of the support material layer from the handling structure. The metalized structures extend through the thickness of the support material layer, and the method includes etching the insulating layer to remove the handling structure, allowing for further processing to create the interconnection element. This patent showcases his expertise in semiconductor technology and innovation.
Career Highlights
Michael Huynh is associated with Adeia Semiconductor Bonding Technologies Inc., where he applies his knowledge and skills to advance semiconductor bonding techniques. His work has been instrumental in developing methods that improve the performance and reliability of semiconductor devices.
Collaborations
Michael has collaborated with talented individuals such as Se Young Yang and Cyprian Emeka Uzoh. These collaborations have fostered an environment of innovation and creativity, contributing to the success of their projects.
Conclusion
Michael Huynh is a distinguished inventor whose work in semiconductor bonding technologies has made a significant impact in the industry. His patent and collaborations reflect his commitment to advancing technology and innovation in this critical field.