Michael Hecker

Title: Michael Hecker - Innovator in Semiconductor Technology

Introduction

Michael Hecker is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of semiconductor technology, particularly in the area of crack prevention during the manufacturing process.

Latest Patents

Hecker holds a patent for a technology titled "Crack trapping in semiconductor device structures." This innovative structure is designed to arrest the propagation of cracks during the dicing of a semiconductor wafer into individual chips. The invention features a monolithic metallic plate that traverses multiple dielectric layers peripheral to an active region of a chip. The design includes one or more metallic plates formed using lithography and electroplating techniques, which are strategically placed between the active device region and a peripheral kerf region. Each metallic plate incorporates a concave feature that faces the kerf region of the wafer, enhancing the durability of the semiconductor devices.

Career Highlights

Michael Hecker is currently employed at Globalfoundries Inc., a leading company in semiconductor manufacturing. His work focuses on advancing technologies that improve the reliability and performance of semiconductor devices.

Collaborations

Hecker has collaborated with several talented individuals in his field, including Nicholas A Polomoff and Mohamed Rabie. These collaborations have contributed to the development of innovative solutions in semiconductor technology.

Conclusion

Michael Hecker's contributions to semiconductor technology, particularly through his patent on crack trapping structures, highlight his role as an influential inventor in the industry. His work continues to impact the reliability of semiconductor devices, showcasing the importance of innovation in this field.