The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Jul. 28, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Nicholas A. Polomoff, Irvine, CA (US);

Mohamed Rabie, Clifton Park, NY (US);

Victoria L. Calero Diaz Del Castillo, Clifton Park, NY (US);

Danielle Degraw, Hyde Park, NY (US);

Michael Hecker, Dresden, DE;

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/00 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/544 (2013.01); H01L 2223/5446 (2013.01);
Abstract

A structure for arresting the propagation of cracks during the dicing of a semiconductor wafer into individual chips includes a monolithic metallic plate that traverses multiple dielectric layers peripheral to an active region of a chip. One or more metallic plates may be formed using lithography and electroplating techniques between the active device region and a peripheral kerf region, where each metallic plate includes a concave feature that faces the kerf region of the wafer.


Find Patent Forward Citations

Loading…