Hyde Park, NY, United States of America

Danielle Degraw


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

where 'Filed Patents' based on already Granted Patents

1 patent (USPTO):

Title: The Innovative Contributions of Danielle Degraw

Introduction

Danielle Degraw is a prominent inventor based in Hyde Park, NY (US). She has made significant contributions to the field of semiconductor technology, particularly in the area of crack propagation prevention during the dicing of semiconductor wafers.

Latest Patents

Danielle holds a patent for a groundbreaking invention titled "Crack trapping in semiconductor device structures." This innovative structure is designed to arrest the propagation of cracks during the dicing process of a semiconductor wafer into individual chips. The invention features a monolithic metallic plate that traverses multiple dielectric layers peripheral to an active region of a chip. One or more metallic plates can be formed using lithography and electroplating techniques between the active device region and a peripheral kerf region. Each metallic plate includes a concave feature that faces the kerf region of the wafer, enhancing the durability and reliability of semiconductor devices.

Career Highlights

Danielle is currently employed at GlobalFoundries Inc., a leading semiconductor manufacturer. Her work at the company has allowed her to apply her innovative ideas and contribute to advancements in semiconductor technology. With her expertise, she has played a vital role in developing solutions that improve the performance and longevity of semiconductor devices.

Collaborations

Throughout her career, Danielle has collaborated with talented professionals in her field, including Nicholas A. Polomoff and Mohamed Rabie. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Danielle Degraw's contributions to semiconductor technology exemplify the impact of innovative thinking in the industry. Her patent for crack trapping in semiconductor device structures showcases her commitment to enhancing the reliability of semiconductor devices. Through her work at GlobalFoundries Inc. and her collaborations with fellow professionals, Danielle continues to push the boundaries of technology and inspire future innovations.

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