Globalfoundries Inc.

Danielle Degraw

Nicholas A Polomoff

Mohamed Rabie

Victoria L Calero Diaz Del Castillo

Michael Hecker

A structure for arresting the propagation of cracks during the dicing of a semiconductor wafer into individual chips includes a monolithic metallic plate that traverses multiple dielectric layers peripheral to an active region of a chip. One or more metallic plates may be formed using lithography and electroplating techniques between the active device region and a peripheral kerf region, where each metallic plate includes a concave feature that faces the kerf region of the wafer.

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Hyde Park, NY, United States of America

Danielle Degraw