Company Filing History:
Years Active: 2016-2023
Title: Discovering the Innovations of Michael Gutzmann
Introduction
Michael Gutzmann is an accomplished inventor based in Forest Grove, Oregon. With a total of four patents to his name, he has made significant contributions to the field of electronic packaging. His innovative work, especially at Intel Corporation, reflects a commitment to advancing technology and improving performance standards within the industry.
Latest Patents
Among his latest patents, Gutzmann has developed an integrated memory coplanar transmission line package, which boasts a ground path that brackets the data path to enhance memory speeds. This innovative electronic package contains a package substrate featuring a bumpout region on its first surface and a pin region on its second surface. The design allows for an efficient data path from the bumpout region to the pin region, creating a streamlined electronic package that stands out in modern technology.
Another noteworthy patent is related to multiple rank high bandwidth memory. This invention outlines methods and apparatuses designed for semiconductor packages that incorporate high bandwidth memory with multiple ranks, showcasing Gutzmann's dedication to refining computational capabilities.
Career Highlights
Michael Gutzmann has made substantial strides in his career as an inventor at Intel Corporation. His work not only highlights his expertise but also underlines the importance of innovation in enhancing electronic devices. Gutzmann's patents exemplify his ability to address industry challenges through cutting-edge solutions.
Collaborations
Gutzmann collaborates closely with talented colleagues such as James A. McCall and Christopher P. Mozak. Together, these professionals contribute to remarkable advancements in electronics, focusing on research and development aimed at improving the functionality and efficiency of technological products.
Conclusion
In conclusion, Michael Gutzmann is a noteworthy inventor whose contributions to the field of electronic packaging have paved the way for enhanced memory technologies. His patents at Intel Corporation reflect not only his inventive spirit but also the collaborative environment that fosters innovation among dedicated professionals. The impact of his work continues to resonate within the tech community, setting new benchmarks for future inventions.