Intel Corporation

Michael Gutzmann

James A McCall

Christopher P Mozak

Randy B Osborne

Kuljit Singh Bains

Pete D Vogt

Chong J Zhao

Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate, that comprises a bumpout region on a first surface of the package substrate, and a pin region on a second surface of the package substrate. In an embodiment, a data path from the bumpout region to the pin region is included in the electronic package. In an embodiment, a ground path brackets the data path from the bumpout region to the pin region.

Integrated memory coplanar transmission line package having ground path that brackets data path to extend memory speeds

Methods and apparatus related to multiple rank high bandwidth memory are described. In one embodiment, a semiconductor package includes a high bandwidth memory with multiple ranks. Other embodiments are also disclosed and claimed.

Multiple rank high bandwidth memory

Apparatus, systems, and methods to reduce power delivery noise for partial writes are described. In one embodiment, an apparatus comprises a processor and a memory control logic to insert one or more dummy unit intervals into data in a write operation when a number of state transitions between adjacent unit intervals exceeds a threshold. Other embodiments are also disclosed and claimed.

Growing community of inventors

Forest Grove, OR, United States of America

Michael Gutzmann