Michael Fuegl

Title: Michael Fuegl - Innovator in Semiconductor Technology

Introduction

Michael Fuegl is a notable inventor based in Neumarkt, Germany. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent. Fuegl's work is characterized by a focus on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

Michael Fuegl holds a patent for a "Molded semiconductor package having an embedded inlay." This invention includes a mold compound, a metal substrate partly embedded in the mold compound, and at least one first metal lead also embedded in the mold compound. The design features an inlay that comprises a semiconductor die embedded in an electrically insulating body. The semiconductor die has a maximum junction temperature that exceeds the glass transition temperature of the mold compound. This innovative approach ensures improved performance and reliability in semiconductor applications.

Career Highlights

Fuegl is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role at Infineon has allowed him to work on cutting-edge technologies that drive advancements in the industry. With a focus on practical applications, Fuegl's contributions have been instrumental in the development of new semiconductor products.

Collaborations

Michael Fuegl has collaborated with esteemed colleagues such as Marcus Boehm and Ludwig Heitzer. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas within the semiconductor field.

Conclusion

Michael Fuegl's work exemplifies the spirit of innovation in semiconductor technology. His patent and contributions to Infineon Technologies AG highlight his commitment to advancing the industry. Fuegl's achievements serve as an inspiration for future inventors in the field.