Infineon Technologies Ag

Infineon Technologies Austria Ag

Michael Fuegl

Thorsten Meyer

Frank Singer

Andreas Grassmann

Ludwig Heitzer

Stefan Woetzel

Waldemar Jakobi

Peter Luniewski

Egbert Lamminger

Frederik Otto

Marcus Boehm

Fabian Craes

Michael Leipenat

Markus Neubert

Christoph Bayer

A semiconductor package includes a substrate including a die pad, first and second discrete transistor dies mounted on the die pad, an encapsulant body that encapsulates the first and second discrete transistor dies, and a plurality of leads that are exposed from the encapsulant body, wherein the first and second discrete transistor dies are connected in parallel with one another by electrical interconnections that electrically connect common terminals of the first and second discrete transistor dies to one of the leads, and wherein at least one of the electrical interconnections has a balanced configuration that provides substantially identical electrical impedance as between the common terminals of the first and second discrete transistor dies and the lead to which they are connected.

Semiconductor package with balanced impedance

A molded semiconductor package includes: a mold compound; a metal substrate partly embedded in the mold compound; at least one first metal lead partly embedded in the mold compound; an inlay embedded in the mold compound, the inlay comprising a semiconductor die embedded in an electrically insulating body, a first metal structure attached to a first side of the semiconductor die, and a second metal structure attached to a second side of the semiconductor die; and a metal clip at least partly embedded in the mold compound and connecting the second metal structure to the at least one first metal lead. The semiconductor die has a maximum junction temperature higher than a glass transition temperature of the mold compound, the electrically insulating body has a glass transition temperature at or above the maximum junction temperature of the semiconductor die, and the metal substrate is attached to the first metal structure.

Molded semiconductor package having an embedded inlay

Growing community of inventors

Neumarkt, Germany

Michael Fuegl