Michael Francis Quinn

Title: Michael Francis Quinn: Innovator in Electrical Device Packaging

Introduction

Michael Francis Quinn is a notable inventor based in Allentown, PA (US). He has made significant contributions to the field of electrical device packaging, particularly through his innovative patent that enhances the stability of wirebonds in packaged devices. His work is crucial for the advancement of high-density input/output (I/O) packaged devices.

Latest Patents

Quinn holds a patent for a device package that features stable wirebonds. The patent describes a method of making a packaged electrical device that involves connecting a wire to two electrical nodes within the package. The process includes heating a predetermined segment of the wire using an external energy source, such as a laser, to a temperature below its melting point but above its recrystallization temperature. This method increases the stiffness modulus of the wire segment, thereby enhancing the physical stability of the wirebonds. This innovation allows for the use of finer wires in the fabrication of high-density I/O packaged devices.

Career Highlights

Michael Quinn is associated with LSI Corporation, where he has applied his expertise in electrical engineering and device packaging. His work has been instrumental in developing technologies that improve the reliability and performance of electronic devices. With a patent count of 1 patent, Quinn continues to contribute to advancements in the field.

Collaborations

Quinn has collaborated with notable colleagues, including Brett J. Campbell and Patrick Joseph Carberry. Their combined efforts have led to significant innovations in the realm of electrical device packaging.

Conclusion

Michael Francis Quinn is a distinguished inventor whose work in electrical device packaging has paved the way for advancements in high-density I/O devices. His innovative approach to wirebond stability is a testament to his expertise and dedication to the field.