Edmonton, Canada

Michael Clark

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Zinite Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Clark. Retrieved from https://idiyas.com/inventor/michael-clark-gnldp2vf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Michael Clark - Innovator in Semiconductor Technology

Introduction

Michael Clark is a notable inventor based in Edmonton, Canada. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to hafnium nitride adhesion layers.

Latest Patents

Michael Clark holds a patent for a novel adhesion layer of hafnium nitride. This invention is particularly useful in the fabrication of semiconductor devices, such as thin film transistors. The hafnium nitride adhesion layer enhances the adherence of metal elements, including molybdenum, tungsten, nickel, ruthenium, cobalt, and their alloys, to the dielectric materials used in semiconductor devices. Additionally, this adhesion layer serves as a diffusion barrier, further improving the performance and reliability of the devices.

Career Highlights

Michael Clark is associated with Zinite Corporation, where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Michael collaborates with talented individuals such as Kenneth C Cadien and Katherine Cook. Their combined efforts contribute to the innovative environment at Zinite Corporation, fostering advancements in semiconductor technology.

Conclusion

Michael Clark's contributions to the field of semiconductor technology through his patent on hafnium nitride adhesion layers exemplify his innovative spirit and dedication to improving device performance. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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