The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Apr. 17, 2024
Applicant:

Zinite Corporation, Edmonton, CA;

Inventors:

Kenneth C. Cadien, Edmonton, CA;

Michael Clark, Edmonton, CA;

Katherine Cook, Edmonton, CA;

Korel Dawkins, Edmonton, CA;

Assignee:

ZINITE CORPORATION, Edmonton, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2025.01); H10D 30/01 (2025.01); H10D 30/67 (2025.01);
U.S. Cl.
CPC ...
H10D 30/673 (2025.01); H01L 21/28194 (2013.01); H10D 30/031 (2025.01); H10D 30/6713 (2025.01); H10D 30/6729 (2025.01);
Abstract

A novel adhesion layer of hafnium nitride useful in the fabrication of semiconductor devices is disclosed. In particular, semiconductor devices such as, for example, thin film transistors which include one or more elements formed of metals with high electron concentrations, such as molybdenum, tungsten, nickel, ruthenium, cobalt and alloys thereof, can employ the present invention to better adhere the metal elements to the dielectric material on which the semiconductor devices are formed and the adhesion layer can also serve as a diffusion barrier.


Find Patent Forward Citations

Cadien, Kenneth. (2025). Hafnium nitride adhesion layer (U.S. Patent No. 12302605). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12302605

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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