Austin, TX, United States of America

Michael Carl Hankes

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.1

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2016-2024

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3 patents (USPTO):Explore Patents

Title: Michael Carl Hankes: Innovator in Substrate Processing Technology

Michael Carl Hankes is a notable inventor based in Austin, TX, who has made significant contributions to the field of substrate processing technology. With a total of 3 patents to his name, Hankes has demonstrated a commitment to innovation and advancement in his industry.

Latest Patents

Hankes' latest patents include a "Substrate enclosure system with assembly for charging a validation wafer." This system features an enclosure designed to couple with an equipment front end module (EFEM) of a substrate processing system. It incorporates a charging assembly and support structures that hold a validation wafer in a position to be charged. Another significant patent is the "Enclosure system with charging assembly," which consists of multiple walls forming an interior volume. This system is also configured to connect with an EFEM and includes a charging assembly with a first charging coil, along with support structures to maintain a validation wafer within a threshold distance for effective charging.

Career Highlights

Hankes is currently employed at Applied Materials, Inc., a leading company in the semiconductor and display industries. His work focuses on developing innovative solutions that enhance substrate processing efficiency and effectiveness.

Collaborations

Some of his notable coworkers include Phillip A Criminale and Zhiqiang Guo, who contribute to the collaborative environment at Applied Materials, Inc. Their combined expertise fosters a culture of innovation and progress within the company.

Conclusion

Michael Carl Hankes is a distinguished inventor whose work in substrate processing technology has led to multiple patents and advancements in the field. His contributions continue to shape the future of substrate processing systems.

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