Lafayette, IN, United States of America

Michael Bodey

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Wabash National, L.p.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Bodey. Retrieved from https://idiyas.com/inventor/michael-bodey

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Michael Bodey: Inventor of a Composite Truck-Floor Connector

Introduction

Michael Bodey is an inventor based in Lafayette, Indiana, whose patent work addresses the connection between a cargo vehicle’s chassis and its body floor. His listed patent is associated with Wabash National, L.P.

Latest Patents

Bodey’s listed patent, “Hardpoint Connectors for Composite Truck Body Floors,” describes a connector that couples a truck chassis’s longitudinal rail to the floor of a cargo body. The connector has a base, a neck, and a head embedded in the floor, along with two legs extending from the base opposite the neck. This design provides a structural connection between the chassis and the cargo floor. Bodey is credited with 1 patent.

Career Highlights

The available information links Bodey’s patent to Wabash National, L.P., a company associated with commercial transportation equipment. His invention focuses on a component used in cargo vehicle construction, connecting the chassis and composite body floor.

Collaborations

The patent record connects Bodey’s work with Wabash National, L.P. No additional collaborators are identified in the information provided.

Conclusion

Michael Bodey’s patented hardpoint connector addresses how a cargo vehicle’s body floor attaches to its chassis, reflecting his contribution to truck-body engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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