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For the Inventor, By the Inventor

Lafayette, IN, United States of America

Wabash National, L.p.


USPTO Granted Patents = 182

% Expired Patents = 9.9



Trademarks = 31

Forward Citations = 2,369

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76 inventors (with patents filed for the assignee):

goldMedal Rodney P Ehrlich (64 out of 79 patents)

silverMedal Andrzej Wylezinski (30 out of 30 patents)

bronzeMedal Leonard William Baker (29 out of 29 patents)

4.  Travis Smith McCloud (22 out of 22 patents)

5.  Francis S Smidler (16 out of 19 patents)

6.  Scott A Storz (15 out of 15 patents)

7.  Michael L Thoma (14 out of 14 patents)

8.  Danny Lee Gilbert (14 out of 15 patents)

9.  David Phillip Kunkel (11 out of 13 patents)

10.  Michael J Courtney (10 out of 12 patents)

11.  James Andrew Sweet (10 out of 11 patents)

12.  Jeffrie Scott Bauer (7 out of 7 patents)

13.  Brian C Belcher (7 out of 7 patents)

14.  Scott M Lewit (7 out of 39 patents)

15.  James Brown (7 out of 7 patents)


Core Competencies:
Composite Truck Body Kits
Reinforced Preforms
Embedded Electrical Grids
Perforated Foam Core
Slide Rail Assembly
Aerodynamic Drag Reduction
Modular Shipping Container
Floor Assembly
Logistic Rail Assembly
Integrated Tire Inflation
Cooling System

182 patents:

1. 12741698 - Hardpoint connectors for composite truck body floors (2026-09-22),
2. 12600287 - Systems and methods for restraining carts and other cargo using forward and rearward brackets (2026-04-14),
3. 12539802 - Embedded mounting inserts (2026-02-03),
4. 12337903 - Reinforced preforms for optimized composite structures (2025-06-24),
5. 12325470 - Composite panel having perforated foam core and method of making the same (2025-06-10),
6. 12319357 - Slide rail assembly and landing gear assembly with embedded hardpoint connectors (2025-06-03),
7. 12168480 - Composite truck body kits (2024-12-17),
8. 12036772 - Composite structure with molded-in wood surface (2024-07-16),
9. 12017435 - Composite structures with embedded electrical grids (2024-06-25),
10. D1024888 - Door assembly for a vehicle (2024-04-30),
11. 11872792 - Composite core with reinforced areas and method (2024-01-16),
12. 11807309 - Composite structures with embedded veils for anchoring fasteners (2023-11-07),
13. 11772715 - Composite panel with connecting strip and method (2023-10-03),
14. 11772712 - Composite floor with integrated conduit (2023-10-03),
15. 11607862 - Extruded molds and methods for manufacturing composite truck panels (2023-03-21),
Company Overview
Wabash National, L.P., headquartered in Lafayette, Indiana, specializes in the development and manufacturing of advanced composite structures. The company focuses on innovative solutions such as composite truck body kits and reinforced preforms, enhancing the durability and efficiency of transportation equipment. Their expertise extends to embedded electrical grids and perforated foam cores, which contribute to aerodynamic drag reduction and modular shipping container designs. Wabash National is committed to advancing technology in the transportation sector, providing high-performance products that meet evolving industry needs.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 13 2026

Wabash National, L.p. USPTO Patent Assignee Logo
182 Patents

#1 in Lafayette, IN

#39 in Indiana

#2,230 in US

#4,583 in the World

Lafayette, IN (US)
Lafayette, IN, United States of America

Wabash National, L.p.

Forward Citations = 2,369

76 inventors:

goldMedal Rodney P Ehrlich (64 out of 79 patents)

silverMedal Andrzej Wylezinski (30 out of 30 patents)

bronzeMedal Leonard William Baker (29 out of 29 patents)

4.  Travis Smith McCloud (22 out of 22 patents)

5.  Francis S Smidler (16 out of 19 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Wabash National, L.p.. Retrieved from https://idiyas.com/company/wabash-national

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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